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Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

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Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

Name: Aviation Parts XQV3004BG352N Xilinx FPGA Package PLASTIC BGA352
Brand: Xilinx
Price: 1 USD

Quality Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352 for sale

MOQ : 1 pcs

Payment Terms : L/C, T/T

Delivery Time : 12-14weeks

Packaging Details : boxes

Brand Name : Xilinx

Model Number : XQV300-4BG352N

Place of Origin : USA

Price : Negotiable

Package : PLASTIC, BGA-352

Programmable Logic Type : FIELD PROGRAMMABLE GATE ARRAY

Combinatorial Delay of a CLB-Max : 0.8 ns

JESD-30 Code : S-PBGA-B352

Operating Temperature-Min : -55.0 Cel

Supply Voltage-Nom : 2.5 V

Supply Voltage-Max : 2.625 V

Technology : CMOS

Terminal Finish : Tin/Lead (Sn63Pb37)

Time@Peak Reflow Temperature-Max (s) : 30

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Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

Descriptions of Aviation Parts :

The QProTM VirtexTM FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 0.22 µm CMOS process. These advances make QPro Virtex FPGAs powerful and flexible alternatives to mask-programmed gate arrays. The Virtex family comprises the four members shown in Table 1. Building on experience gained from previous generations of FPGAs, the Virtex family represents a revolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the QPro Virtex family delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market. Refer to the "VirtexTM 2.5V Field Programmable Gate Arrays" commercial data sheet for more information on device architecture and timing specifications.

Features of Aviation Parts:

Certified to MIL-PRF-38535 (Qualified Manufacturer Listing) Guaranteed over the full military temperature range to +125°C) Ceramic and Plastic Packages Fast, high-density Field-Programmable Gate Arrays Densities from to 1M system gates System performance to 200 MHz Hot-swappable for Compact PCI 16 high-performance interface standards Connects directly to ZBTRAM devices Four dedicated delay-locked loops (DLLs) for advanced clock control Four primary low-skew global clock distribution nets, plus 24 secondary global nets LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit Shift Register Configurable synchronous dual-ported 4K-bit RAMs Fast interfaces to external high-performance RAMs Dedicated carry logic for high-speed arithmetic Dedicated multiplier support Cascade chain for wide-input functions Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset Internal 3-state bussing IEEE 1149.1 boundary-scan logic Die-temperature sensing device

Specification of Aviation Parts :

Mfr Package Description	PLASTIC, BGA-352
REACH Compliant	Yes
Status	Discontinued
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Combinatorial Delay of a CLB-Max	0.8 ns
JESD-30 Code	S-PBGA-B352
JESD-609 Code	e0
Moisture Sensitivity Level	3
Number of CLBs	1536.0
Number of Equivalent Gates	322970.0
Number of Inputs	260.0
Number of Logic Cells	6912.0
Number of Outputs	260.0
Number of Terminals	352
Operating Temperature-Min	-55.0 Cel
Operating Temperature-Max	125.0 Cel
Organization	1536 CLBS, 322970 GATES
Package Body Material	PLASTIC/EPOXY
Package Code	LBGA
Package Equivalence Code	BGA352,26X26,50
Package Shape	SQUARE
Package Style	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)	225
Power Supplies	1.2/3.6,2.5
Qualification Status	Not Qualified
Screening Level	38535Q/M;38534H;883B
Seated Height-Max	1.7 mm
Sub Category	Field Programmable Gate Arrays
Supply Voltage-Nom	2.5 V
Supply Voltage-Min	2.375 V
Supply Voltage-Max	2.625 V
Surface Mount	YES
Technology	CMOS
Temperature Grade	MILITARY
Terminal Finish	Tin/Lead (Sn63Pb37)
Terminal Form	BALL
Terminal Pitch	1.27 mm
Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Length	35.0 mm
Width	35.0 mm

Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352

Aviation Parts XQV300-4BG352N Xilinx FPGA Package PLASTIC, BGA-352 Images

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